Description
GB-20S is a panel-level high-speed die bonder that operates on the principle of batch die bonding. It pre-arranges the die on the bonding head before performing the entire group bonding process, achieving high-speed die bonding performance on large substrates. It can operate on substrates pre-coated with adhesive material, solder paste, flux, or double-sided adhesive film. The die tape frame can automatically load and unload, while the substrate requires manual loading and unloading.
- Adopts the operation mode of pre-arranging and then bonding the entire group of dies, meeting the high production capacity requirements on large substrates.
- The bonding compression time is relatively sufficient compared to single die operations, which can improve adhesive reliability.
- The main spindle adopts linear motor drive to maintain long-term accuracy in picking and placing.
- Immediate confirmation of picking status after picking to eliminate potential subsequent damage caused by picking errors.
- Immediate inspection of placement results after pre-arrangement.
- Flip and non-flip dual-use.
